Products application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Introduction of our craft capability : Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness Min. thickness: 0.4mm(16mil) Max. thickness: 3.2mm(128mil) Layer count 1 to 28 Layers Max. Board Size 23.00" x 35.00"(580mm*900mm) IPC Class Class II, Class III , Class 1 Annular Ring 5 mil/side or Greater (Min. Design) Finish Plating Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold, Other Copper Weight 0.5OZ-7OZ Trace/Space Width 3 Mils or Greater Drill Clearance 0.1mm(laser drilling) Plated Slots 0.036 or Greater Smallest Hole (Finished) 0.1mm or Greater Gold Fingers 1 to 4 Edge (30 to 50 Micron Gold) SMD Pitch 0.080" - 0.020" - 0.010" Soldermask Type LPI Glossy, LPI-Matte, SR1000 Soldermask Color Green, Red, Blue, Black, White, Yellow, Legend Color White, Yellow, Black, Red, Blue CNC Route Point Any Minimum Route Width 0.031" Scoring Straight Lines, Jump Scoring, Panel Edge to Edge, CNC* Body Gold HARD*, IMMERSION* (up to 50 MICRON GOLD) Data File Format Gerber 274x with embedder aperture Fab. Drawing Format DXF, HPGL, DWG, PDF, Gerber E.T Testing Flying Probe, Single Sided, 1up Plate, Clampshell, Net List Counter Sink / Counter Bore Availiable up to 0.250 Diameter Control Impedence Yes Blind Vias / Buried Vias Yes Peelable Mask Yes Carbon Yes
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