Product Description
Products application:
Communication, internet, industrial control,
computer application, consumptive electronics,
spaceflight, curative application Etc.
Introduction of our craft capability :
Specifications
Details
Material Type
FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont
Material Thickness
Min. thickness: 0.4mm(16mil)
Max. thickness: 3.2mm(128mil)
Layer count
1 to 28 Layers
Max. Board Size
23.00" x 35.00"(580mm*900mm)
IPC Class
Class II, Class III , Class 1
Annular Ring
5 mil/side or Greater (Min. Design)
Finish Plating
Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold, Other
Copper Weight
0.5OZ-7OZ
Trace/Space Width
3 Mils or Greater
Drill Clearance
0.1mm(laser drilling)
Plated Slots
0.036 or Greater
Smallest Hole (Finished)
0.1mm or Greater
Gold Fingers
1 to 4 Edge (30 to 50 Micron Gold)
SMD Pitch
0.080" - 0.020" - 0.010"
Soldermask Type
LPI Glossy, LPI-Matte, SR1000
Soldermask Color
Green, Red, Blue, Black, White, Yellow,
Legend Color
White, Yellow, Black, Red, Blue
CNC Route Point
Any
Minimum Route Width
0.031"
Scoring
Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*
Body Gold
HARD*, IMMERSION* (up to 50 MICRON GOLD)
Data File Format
Gerber 274x with embedder aperture
Fab. Drawing Format
DXF, HPGL, DWG, PDF, Gerber
E.T Testing
Flying Probe, Single Sided, 1up Plate, Clampshell, Net List
Counter Sink / Counter Bore
Availiable up to 0.250 Diameter
Control Impedence
Yes
Blind Vias / Buried Vias
Yes
Peelable Mask
Yes
Carbon
Yes